FAQs
More FAQs- What causes mould?
- How soon can we return to our workspace after a disinfection service has been completed?
- How does mould spread?
Excess moisture caused by leaks or flooding in your commercial property — especially in typically damp environments like the kitchen and bathrooms — creates the perfect breeding ground for mould or mildew. To control and reduce the risk for mould growth in these areas, you must properly maintain your plumbing system and monitor any appliances in your facility that use large quantities of water, such as dish washers. Small amounts of indoor mould are unavoidable and usually harmless. In damp environments, however, mould spores can more easily reproduce and cause more serious and difficult to remove mould problems.
We understand that time is of the essence when it comes to running a business, which is why we strive to complete our disinfection services as quickly and effectively as possible. The timeline for returning to your workspace after our service will depend on the severity of the contamination and the size of the affected area. Our highly trained technicians use specialized products and equipment to safely remove and all pathogens and contaminants. This ensures that your workspace is thoroughly disinfected and safe for you and your employees to return to. We also isolate the affected area during the disinfection process to prevent any potential spread of contamination. Rest assured that we work quickly and diligently so that you can resume business operations in a clean and safe environment. Your safety, satisfaction and peace of mind are our top priorities at ServiceMaster Restore.
For moulds to grow and reproduce, they need a damp environment and an organic food source, such as cellulose, which is found in many building materials such as wood, drywall, ceiling tiles, and other household materials such as carpeting and fabrics. Mould can also grow in a home’s HVAC system, gutters, roof, foundation, and other areas where the environment encourages mould growth.